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300MM FOSB cleaning machine

The unit uses surfactant in De-ionized (DI) water in the wash chambe;
​DI water in the rinse and spray chambers, and heated clean dry air (CDA) in the drychambers;

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300MM FOSB cleaning machine

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Product Details

Process Description: 

-- The unit uses surfactant in De-ionized (DI) water in the wash chambe;

-- DI water in the rinse and spray chambers, and heated clean dry air (CDA) in the drychambers;

Key Parameters: 

-- Clean standard: cleanroom class 1k

-- Software: Wonderware to provide in-process monitoring 

-- BC tracking: use RFID BC reader to keep track of the RFID   

-- code on FOUP & FOSB

-- PLC: Siemens PLC S7-300 

-- CT:  20 carrier/hrs. 

Application: 

Semi-conductor silicon wafer carrier cleaning.

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Product Details

Process Description: 

-- The unit uses surfactant in De-ionized (DI) water in the wash chambe;

-- DI water in the rinse and spray chambers, and heated clean dry air (CDA) in the drychambers;

Key Parameters: 

-- Clean standard: cleanroom class 1k

-- Software: Wonderware to provide in-process monitoring 

-- BC tracking: use RFID BC reader to keep track of the RFID   

-- code on FOUP & FOSB

-- PLC: Siemens PLC S7-300 

-- CT:  20 carrier/hrs. 

Application: 

Semi-conductor silicon wafer carrier cleaning.

300MM FOSB cleaning machine
The unit uses surfactant in De-ionized (DI) water in the wash chambe;
​DI water in the rinse and spray chambers, and heated clean dry air (CDA) in the drychambers;
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300MM FOSB cleaning machine

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