Product Display
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Rinse Water free Cleaning Equipment (Model number: UG-8680)
Mature applications in deflux cleaning for high-capacity semiconductor BGA, flip-chip, SIP, FCCSP, IGBT, Lead Frame, PLP, IC, PCBA, carrier board and other products.
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300MM FOSB cleaning machine
The unit uses surfactant in De-ionized (DI) water in the wash chambe; DI water in the rinse and spray chambers, and heated clean dry air (CDA) in the drychambers;
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300MM FOSB Auto-packaging machine
RFID reading and writing, wafer status visual inspection, FOSB Accessories removal, label printing and attaching, heat-sealing PE & Alu bags after vacuuming, visual inspection for the heat sealing effects.
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FOUP & FOSB Manual Bagging Sealing Tool
This tool is used in Class 10 cleanrooms, to package FOUP & FOSB(shipping box for wafers)
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